Modeling of Deformation and Texture Development of Copper in a 120°
ECAE Die [PDF]
Roxane Arruffat Massion, L. S. Toth, Jean-Philippe MathieuA flow line function is proposed to describe the material deformation in ECAE for a 120\degree die. This new analytical approach is incorporated into a viscoplastic self-consistent polycrystal code to simulate the texture evolution in Route A of copper and compared to experimental textures as well as to those corresponding to simple shear.View original: http://arxiv.org/abs/1205.2745
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